Rehm will exhibit at Intersolar a void-free vacuum soldering system with a temperature range of 50°C to 450°C, which includes advanced condensation reflow for lower temperatures, up to their latest high-temperature VS offerings. The VS 160S offers oxidation-free and void-free interconnections between chip and substrate in packaging applications, Rehm says.
Rehm says it VS systems are particularly useful for photovoltaic concentrator module assembly, which requires high temperatures and void-free high power interconnections. Concentrated solar technology replaces the majority of the semiconductor content of traditional modules with less expensive optics, and thereby reduces costs while promising to boost cell efficiency to far over 25%.
Rehm
www.rehm-group.com
